At Qubist Solutions, we partner with forward-thinking semiconductor giants—spanning memory, AI compute , and embedded processing —to deliver precision-driven software engineering tailored for the complex needs of silicon development, validation, and integration.
1. Embedded Firmware & Hardware Integration
From microcontrollers and ASICs to SoCs and chiplets, we offer embedded firmware, driver development, bootloader design, board support packages (BSP), middleware, and FPGA bring-up—all with a robust understanding of low-level hardware contexts. We align closely with Infosys' offerings in semiconductor embedded systems, including firmware, BSPs, and hardware-layer services.
2. Architecture & Design Enablement
We aid chip development—from architecture planning and RTL design to physical layout optimization, utilizing node-specific methodologies, PDK integration, and IP validation frameworks. Drawing inspiration from Samsung’s design enablement models with foundation IP (PCIe, SerDes, memory) and optimized process libraries, we support accelerated tape-out cycles.
3. End-to-End Design Lifecycle & Digital Twins
We support the full silicon lifecycle—from design specification, pre-silicon validation and FPGA emulation to post-silicon silicon validation and qualification—similar to HCLTech’s spec-to-tape-out and digital twin accelerators.
4. Design Data & IP Management
Our platform supports scalable design data version controls, workspace synchronization, hybrid cloud bursting, and high-performance compute workflows, similar to IC Manage’s Global Design Platform (GDP) and big-data-driven accelerate environments.
5. AI-Driven Automation & Testing
We harness artificial intelligence, including generative AI, to automate test case generation, specification analysis, validation pipelines, and design-for-test (DFT) optimizations—empowering rapid iteration and higher design confidence, much like HCLTech’s “AI-driven chip design developer” accelerators.
6. Yield Optimization & Manufacturing Analytics
We deliver smart analytics and software tools for yield improvement, fab optimization, and manufacturing cycle reduction, aligning with domain challenges of complexity and time-to-market constraints.
7. Security, Compliance & IP Protection
Our solutions embed rigorous security protocols—secure IP management, robust encryption, traceability, and auditability. We bolster design integrity and IP protection across multiple nodes, drawing from industry best practices.
Domain Mastery Across Layers – From silicon firmware to architecture, validation, and lifecycle engineering, seamlessly bridging hardware and software domains.
Partnering with Leading Practices – We co-engineer with customer IP, PDKs, and EDA tools to maximize design accuracy and tape-out success (in the vein of Samsung’s SAFE/QEDA ecosystem).
Accelerated Go-to-Market – With digital-twin modeling, AI-augmented workflows, and hybrid-cloud scalability, we drastically reduce development time for high-pressure silicon projects.
Scalable, Flexible Engagement Models – We adapt to your needs—whether turnkey product engineering, ongoing co-development, or staff augmentation.
Cross-Industry Innovation – Drawing upon embedded knowledge from automotive, healthcare, IoT, and avionics to elevate chip reliability, safety, and innovation.